The Thermal paste GENESIS Silicon 900 12.8 W/m·K 8 g is compared with several alternative packaging options from the same brand, as well as a thermal adhesive sheet from a different manufacturer. All Genesis Silicon 900 paste variants share identical thermal conductivity and density specifications, differing primarily in packaging volume and format. Meanwhile, the GrauGear alternative provides a sheet format designed for different mounting scenarios.
⚙️ The technical specifications comparison covers core thermal conductivity, density, and volume parameters to evaluate the efficiency and practicality of each option.
| Parameter | Thermal paste GENESIS Silicon 900 12.8 W/m·K 8 g | Thermal paste GENESIS Silicon 900 12.8 W/m·K 2 g | Genesis Silicon 900 8g Thermal Paste | Genesis Silicon 900 2g Thermal Paste | Thermal grease GENESIS Silicon 900 Grey 250 °C 1 pc | Thermal adhesive (heat sink compound) GrauGear G-TMP-13W | Practical conclusion |
|---|
| Product type | Thermal paste | Thermal paste | Thermal paste | Thermal paste | Thermal grease | Thermal adhesive | Defines application method: paste is dispensed from a tube, whereas GrauGear is supplied as a ready-to-use sheet. |
| Thermal conductivity | 12.8 W/m·K | 12.8 W/m·K | 12.8 W/m·K | 12.8 W/m·K | Not specified | 12.8 W/m·K | High thermal conductivity across most variants ensures efficient heat dissipation from processors. |
| Density | 2.8 g/cm³ | 2.8 g/cm³ | 2.8 g/cm³ | 2.8 g/cm³ | Not specified | Not specified | Identical density across Genesis pastes guarantees consistent physical handling during application. |
| Quantity / Volume | 8 g | 2 g | 8 g | 2 g | 1 pc(s) | 1 pc(s) (45×100×1 mm) | The larger 8 g volume is ideal for maintaining multiple PCs, while 2 g suits a single installation. |
◎ The comparison of use cases and buyer needs helps determine the most suitable thermal interface product based on the scope of work and hardware requirements.
| Use case | Recommended product | Why |
|---|
| Servicing multiple PCs or frequent hardware maintenance | Thermal paste GENESIS Silicon 900 12.8 W/m·K 8 g | The larger 8 g quantity provides enough compound for multiple applications without requiring frequent repurchasing. |
| Single PC build or one-time thermal paste replacement | Thermal paste GENESIS Silicon 900 12.8 W/m·K 2 g | The 2-gram version offers just the right amount of paste for a single installation without excess material. |
| Bonding heat sinks while establishing thermal contact | Thermal adhesive (heat sink compound) GrauGear G-TMP-13W | Supplied as a sheet format that combines thermal transfer with mechanical fixation of components. |
The primary difference between Thermal paste GENESIS Silicon 900 12.8 W/m·K 8 g and the smaller volume versions is the increased compound quantity in the package, while core thermal performance remains identical. This product is best suited for users who need a larger supply for regular maintenance or multiple builds. Smaller packaging options are more convenient for one-off tasks, whereas the GrauGear sheet is preferable when mechanical bonding of heat sinks is required.
